PIPS II System Precision Ion Polishing System | Gatan, Inc.

Advantages:

X,Y stage permits alignment of argon beams to region of interest on the sample
Improved collimated beam provides useable voltages as low as 100 volts for rapid and damage free preparation of FIB lamella
Digital optical imaging with image storage and analysis in DigitalMicrograph^® software
10" color touch screen for display and control of all PIPS™ II parameters

Media Library:

View Media Library

Publications

Mg segregation at inclined facets of pyramidal inversion domains in GaN:Mg

Scientific Reports

2022

Persson, A. R.; Papamichail, A.; Darakchieva, V.

Strength and elastic modulus enhancement in Mg-Li-Al matrix composites reinforced by ex situ TiB2 particles via stir casting

Science Direct

2022

Sun, J.; Ding, D.; Liu, W.; Wu, W.; Liu, H.; Wei, G.; Liu, H.

Effect of Fe addition on the microstructure, transformation behaviour and superelasticity of NiTi alloys fabricated by laser powder bed fusion

Virtual and Physical Prototyping

2022

Xi, R.; Jiang, H.; Li, G.; Zhang, Z.; Zhao, G.; Vanmeensel, K.; Kustov, S.; Humbeeck. J. V.; Wang. X.

Resources:

Model 695

Datasheet

Precision Ion Polishing System (PIPS™) II

Applications

Application of PIPS II system for cross-sectional TEM specimen preparation of semiconductor devices

Argon ion polishing of focused ion beam specimens in PIPS II system

Ready, set, go! Ensuring an identical TEM specimen preparation route again and again

Protocols

Cleaning guns and cold cathode gauge
Stage and beam alignment
Lamella alignment
Lamella recipe

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Firmware

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