- Quickly cut simple holes, unique shapes, or TEM discs from hard, brittle materials such as semiconductors, ceramics, and geological materials
- Cut materials ranging in thickness from <40 µm to 5 mm utilizing a piezo-electric crystal driving a tubular cutting tool in a fine grain, boron carbide slurry
- Minimize mechanical and thermal damage using a manually tuned frequency driver to optimize cutting speed
- Reduce edge chipping and sample damage with the spring-loaded platform and magnetically held table to prevent lateral movement
- Precisely center your site-specific area with an integrated stereomicroscope and X,Y table
Model 601
Datasheet
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